# MEB - Engineering

Provider: [Defense Microelectronics Activity](https://programs.cccareers.org/providers/defense-microelectronics-activity)

- Program type: Not listed
- Branches: All branches
- Format: In person
- Length: 151 - 180 days
- Locations: McClellan Park, CA
- Website: https://acq.osd.mil/asds/dmea.strategy/html
- Contact: Jeremy Bridge, jeremy.d.bridge.civ@mail.mil
- Page: https://programs.cccareers.org/programs/defense-microelectronics-activity-meb-engineering-0vj4mt

## Summary

The incumbent serves as a Warfighter Support Division Electronics Technician in support of (but not limited to) the following client funded programs: Technical Data Packages, Quick Reaction Engineering (QRE), and Legacy Systems Sustainment.

## Job description

Work involves reverse engineering, rapid prototyping, technology insertion, and the support of advanced microelectronics technologies in fielded weapon systems and new developments. Incumbent also supports back-end manufacturing PCB packaging/assembly, environmental tests, inspection and screening processes for the printed circuit board assembly (PCBA) tools, automated solder paste screen printing, surface mount (SMT) Pick & Place and reflow soldering for mix technologies (i.e.,Pb and Pb-Free solder, lead and lead-free respectively), PCBA rework/repair, product environmental testing for military and space applications, counterfeit inspections, and PCBA Inspections. Incumbent is responsible for assembly, disassembly, and repair of miniature circuit card assemblies with ultra-fine pitch components, such as 36-pin uBGA with 0.4mm pitch between pins, Wafer Chip Scale Package(WCSP), Fine Pitch Ball Grid Array (FBGA), Quad Flat No-leads (QFN), and Land Grid Array (LGA) packages, with and without ground plane, 01005 Discrete Elements, and other challenging components, assembly, disassembly, and repair of through-hole components onto a printed circuit board (PCB) using hand tools, interfacing with engineering team to build unique and custom cable assemblies, troubleshooting electronics assemblies using electronic bench equipment, such as multi-meters and oscilloscopes, and more advanced tools, such as X-Ray, and assembly of next higher assembly systems, involving multiple circuit cards, enclosures, and epoxies to meet mechanical requirements.(90%)

## Locations

- McClellan Park, CA, 95652 (near McClellan Park, CA)

Source: public DoD SkillBridge listings via CCC Programs. Confirm details with the provider and your chain of command.